WG-1230 automatic thinning machine

WG-1230 automatic thinning machine

Simple and compact automatic thinning machine to support grinding of 8-inch SiC ingots and wafers

Product Classification:

Automatic thinning machine

Semiconductor Equipment Division

Details

Technical features:

● Silicon carbide ingots (maximum thickness 5000mm), special-shaped sheets with frames and non-standard 4/6/8 inch SiC wafers can be processed. The diameter of the grinding wheel is Φ300mm, the maximum thinning rate is 0.9 μm/s, and the single-chip grinding time is less than 5 minutes;
● Single spindle single station automatic thinning machine, online measurement mode (measurement range 0-1800μm)/offline measurement mode (measurement range 0-50000μm) is optional; The sheet loading and unloading operations are carried out manually and the sheet bearing table is manually cleaned by oil stone.

 

Performance indicators:

WG-1230 automatic thinning machine
Grinding mode Vertical/horizontal plunge grinding by rotating the wafer
Structure mode 1 spindle, 2 sheet-bearing tables
Grinding dimension   mm Max.Ø300/Max.Ø200(ø4 ″-ø12 ″)
Spindle Number of spindles - 1
Spindle power KW 7.5
Spindle speed rpm 1000-4000
Z-axis travel mm 120
Z-axis resolution Μm 0.1
Bearing table Loading method - vacuum adsorption
Bearing table type - Porous ceramic plate bearing table
Speed rpm 0-300
Quantity Sleeve 1
Cleaning method of film bearing table - Manual cleaning of oilstone
Bearing table Y direction Y-direction machining stroke mm 400
Y-direction feed speed mm/s 0.01-50
Y axis fast displacement velocity mm/s 100
Y-axis minimum resolution mm 0.001
Equipment Overall dimension WxD × H mm 860 × 1847 × 1741
Equipment weight kg Approximately 1700.

 

Key words:

WG-1230 automatic thinning machine

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