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WG-1250 automatic thinning machine
Product Classification:
Details
Technical features:
● Silicon carbide ingots (maximum thickness 5000mm), special-shaped sheets with frames and non-standard 4/6/8 inch SiC wafers can be processed. The diameter of the grinding wheel is Φ300mm, the maximum thinning rate is 0.9 μm/s, and the single-chip grinding time is less than 5 minutes;
● Single spindle single station automatic thinning machine, online measurement mode (measurement range 0-1800μm)/offline measurement mode (measurement range 0-50000μm) is optional; The sheet loading and unloading operations are carried out manually and the sheet bearing table is manually cleaned by oil stone.
Performance indicators:
| WG-1250 automatic thinning machine | |||
| Grinding mode | In-feed grinding with wafer rotation for longitudinal plunge grinding by rotating the wafer | ||
| Structure mode | 1 spindle, 3 bearing tables, 1 rotary table | ||
| Grinding dimension | mm | Max.Ø200 (φ 4 ″-φ 8 ″) | |
| Diameter of grinding wheel | mm | Φ300 | |
| Spindle | Type | - | High frequency motor built-in air spindle |
| Number of spindles | - | 2 | |
| Quota power | KW | 7.5 | |
| Spindle speed | mm | 1000-4000 | |
| Z-axis resolution | Μm | 0.1 | |
| Bearing table | Loading method | - | vacuum adsorption |
| Bearing table type | - | porous ceramic type | |
| Speed | rpm | 0-300 | |
| Number of sheet-bearing tables | Sleeve | 3 | |
| Cleaning method of film bearing table | - | Manual cleaning of oilstone | |
| Thinning accuracy | Intra-slice thickness deviation | Μm | ≤ 2 |
| Thickness deviation between sheets | Μm | ≤ ± 2 | |
| Surface roughness Ra | nm | ≤3(#30000 wheel,SiC) | |
| Equipment | Overall dimension WxD × H | mm | 1446 × 1860 × 1875 |
| Equipment weight | kg | 3800 | |
Key words:
WG-1250 automatic thinning machine
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