WG-1261 automatic thinning machine

WG-1261 automatic thinning machine

The newly developed fully automatic thinning machine can support the grinding of 8-inch SiC substrates and wafers

Product Classification:

Automatic thinning machine

Semiconductor Equipment Division

Details

Technical features:

● The diameter of the grinding wheel is Φ300mm, the maximum thinning rate is 0.9 μm/s, and the single-chip grinding time is less than 5 minutes. Choose high power and high torque spindle, can achieve high efficiency, high precision, no damage mirror processing;
● Double spindle three-station full-automatic thinning machine, equipped with an online measuring instrument unit (measuring range 0-1800μm) to accurately control the thinning thickness; With SECS/GEM networking function. Configure SMIF (optional) to maintain high cleanliness and stable thinning.

 

Performance indicators:

WG-1250 automatic thinning machine
Grinding mode Vertical plunge grinding by rotating the wafer
Structure mode 1 spindle, 3 bearing tables, 1 rotary table
Grinding dimension   mm Max.Ø200 (φ 6 ″-φ 8 ″)
Diameter of grinding wheel   mm Φ300
Spindle Number of spindles - 2
Spindle power KW 7.5
Spindle speed rpm 1000-4000
Z-axis travel mm 120
  Z-axis resolution Μm 0.1
Bearing table Loading method - vacuum adsorption
Bearing table type - Porous ceramic type (6/8 inch compatible)
Speed rpm 0-300
Number of sheet-bearing tables Sleeve 3
Cleaning method of film bearing table - Manual cleaning of oilstone
Thinning accuracy Intra-slice thickness deviation Μm ≤ 2
Thickness deviation between sheets Μm ≤ ± 2
Surface roughness Jin nm ≤3(#30000 wheel,SiC)
Equipment Overall dimension WxD × H mm 1445 × 3330 × 1895
Equipment weight kg 4700

 

Key words:

WG-1261 automatic thinning machine

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