WG-1251 automatic thinning machine

WG-1251 automatic thinning machine

Support wafer process evolution towards thinner/larger diameter grinding (up to 12 inches)

Product Classification:

Automatic thinning machine

Semiconductor Equipment Division

Details

Technical features:

● The use of rough grinding and fine grinding track coincidence technology significantly improves the stability of ultra-thin wafer grinding quality, and can realize precision thinning of 12-inch wafer thickness below 100μm;
● Double-spindle three-station full-automatic thinning machine, which can form an online system with single-axis polishing machine and protective film processing equipment to realize the integration of wafer thinning to stress relief technology; Equipped with independent and optimized 12-inch ultra-precision air spindle and air floating platform; With SECS/GEM networking function.

 

Performance indicators:

WG-1251 automatic thinning machine
Grinding mode Vertical plunge grinding by rotating the wafer
Structure mode 1 spindle, 3 bearing tables, 1 rotary table
Grinding dimension   mm Max.Ø300 (φ 8 ″-φ 12 ″)
Diameter of grinding wheel   mm Φ300
Spindle Number of spindles - 2
Spindle power KW 7.5
Spindle speed rpm 1000-4000
Z-axis travel mm 120
Z-axis resolution Μm 0.1
Bearing table Loading method - vacuum adsorption
Bearing table type - Porous ceramic type (8/12 inch compatible)
Speed rpm 0-300
Number of sheet-bearing tables Sleeve 3
Thinning accuracy Intra-slice thickness deviation Μm ≤ 3
Thickness deviation between sheets Μm ≤ ± 3
Surface roughness Jin Μm ≤0.002(#20000 wheel,Si)
Equipment Overall dimension WxD × H mm 1445 × 3330 × 1895
Equipment weight kg Approximately 4700.

 

Key words:

WG-1251 automatic thinning machine

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