WG-1281 automatic thinning machine

WG-1281 automatic thinning machine

Newly developed fully automatic thinning machine with spindle X-direction traverse function to support TAIKO edging grinding process

Product Classification:

Automatic thinning machine

Semiconductor Equipment Division

Details

Technical features:

● Silicon carbide ingots (maximum thickness 5000mm), special-shaped sheets with frames and non-standard 4/6/8 inch SiC wafers can be processed. The diameter of the grinding wheel is Φ300mm, the maximum thinning rate is 0.9 μm/s, and the single-chip grinding time is less than 5 minutes;
● Single spindle single station automatic thinning machine, online measurement mode (measurement range 0-1800μm)/offline measurement mode (measurement range 0-50000μm) is optional; The sheet loading and unloading operations are carried out manually and the sheet bearing table is manually cleaned by oil stone.

 

Performance indicators:

WG-1281 automatic thinning machine
Grinding mode Vertical plunge grinding by rotating the wafer
Structure mode 2 spindles, 3 bearing tables, 1 rotary table
Grinding dimension   mm Max.Ø300 (φ 8 ″-φ 12 ″)
Diameter of grinding wheel   mm Special grinding wheel
Spindle Number of spindles - 2
Spindle power KW 5.5
Spindle speed rpm 1000-6000
Z-axis travel mm 120
Z-axis resolution Μm 0.1
Bearing table Loading method - vacuum adsorption
Bearing table type - Porous ceramic type (pure 8 inch/pure 12 inch)
Speed rpm 0-300
Quantity Sleeve 3
Thinning accuracy Intra-slice thickness deviation Μm ≤ 4
Thickness deviation between sheets Μm ≤ ± 4
Surface roughness Ra Μm ≤0.02(#3000 wheel,)
Rough grinding Ring accuracy Μm 3±0.15
Rough grinding ring accuracy Μm 3.5±0.15
Equipment Overall dimension WxD × H mm 1450 × 3800 × 1900
Equipment weight kg 4700

 

Key words:

WG-1281 automatic thinning machine

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