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WG-1240 automatic thinning machine
Product Classification:
Details
Technical features:
● The use of rough grinding and fine grinding track coincidence technology significantly improves the stability of ultra-thin wafer grinding quality, and can realize precision thinning of 12-inch wafer thickness below 100μm;
● Double-spindle three-station full-automatic thinning machine, which can form an online system with single-axis polishing machine and protective film processing equipment to realize the integration of wafer thinning to stress relief technology; Equipped with independent and optimized 12-inch ultra-precision air spindle and air floating platform; With SECS/GEM networking function.
Performance indicators:
| WG-1240 automatic thinning machine | |||
| Grinding mode | Vertical/horizontal plunge grinding by rotating the wafer | ||
| Structure mode | 1 spindle, 1 piece bearing table | ||
| Grinding dimension | mm | Max.Ø300/Max.Ø200 (1933 8 ″-0312 ″) | |
| Spindle | Number of spindles | - | 1 |
| Spindle power | KW | 5.5 | |
| Spindle speed | rpm | 1000-6000 | |
| Z-axis travel | mm | 120 | |
| Z-axis resolution | Μm | 0.1 | |
| Bearing table | Loading method | - | vacuum adsorption |
| Bearing table type | - | porous ceramic type | |
| Speed | rpm | 0-300 | |
| Quantity | Sleeve | 1 | |
| Cleaning method of film bearing table | - | Manual cleaning of oilstone | |
| Bearing table Y direction | Y-direction machining stroke | mm | 400 |
| Y-direction feed speed | mm/s | 0.01-50 | |
| Y axis fast displacement velocity | mm/s | 100 | |
| Y-axis minimum resolution | mm | 0.001 | |
| Thinning accuracy | Intra-slice thickness deviation | Μm | ≤ 4 |
| Thickness deviation between sheets | Μm | ≤ ± 4 | |
| Rough grinding Ring accuracy | mm | 3±0.15 | |
| Equipment | Overall dimension WxD × H | mm | 860 × 1847 × 1741 |
| Equipment weight | kg | Approximately 1700. | |
Key words:
WG-1240 automatic thinning machine
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