WG-8501 automatic thinning machine

WG-8501 automatic thinning machine

Support wafer process evolution towards thinner grinding (up to 8 inches)

Product Classification:

Automatic thinning machine

Semiconductor Equipment Division

Details

Technical features:

● The use of rough grinding and fine grinding track coincidence technology significantly improves the stability of ultra-thin wafer grinding quality, and can realize precision thinning of 8-inch wafer thickness below 100μm;
● Double-spindle three-station full-automatic thinning machine, equipped with on-line measuring instrument unit to accurately control the thinning thickness; Equipped with independent and optimized 8-inch ultra-precision air spindle and air floating platform; With SECS/GEM networking function.

 

Performance indicators:

WG-8501 automatic thinning machine
Grinding mode Vertical plunge grinding by rotating the wafer
Structure mode 1 spindle, 3 bearing tables, 1 rotary table
Grinding dimension   mm Max.Ø200 (φ 4 ″-φ 8 ″)
Diameter of grinding wheel   mm Φ200
Spindle Number of spindles - 2
Spindle power KW 5.5
Spindle speed rpm 1000-6000
Z-axis travel mm 120
Z-axis resolution Μm 0.1
Bearing table Loading method - vacuum adsorption
Bearing table type - Porous ceramic type (6/8 inch compatible)
Speed rpm 0-300
Number of sheet-bearing tables Sleeve 3
Thinning accuracy Intra-slice thickness deviation Μm ≤ 2.5
Thickness deviation between sheets Μm ≤ ± 2.5
Surface roughness Jin Μm ≤0.002(#20000 wheel,Si)
Equipment Overall dimension WxD × H mm 1200 × 2760 × 1950
Equipment weight kg Approximately 3800.

 

Key words:

WG-8501 automatic thinning machine

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