WG-8500 automatic thinning machine

WG-8500 automatic thinning machine

A variety of customizable double-station thinning machine

Product Classification:

Automatic thinning machine

Semiconductor Equipment Division

Details

Technical features:

● Grinding special-shaped sheet with frame, which can correspond to a frame of 8 inches at most; The rough grinding and fine grinding track is unified to improve the stability of processing quality;
● Double spindle three-position automatic thinning machine, rough grinding and fine grinding at the same time, the processing efficiency is greatly improved.

 

Performance indicators:

WG-8500 automatic thinning machine
Grinding mode Vertical plunge grinding by rotating the wafer
Structure mode 1 spindle, 3 bearing tables, 1 rotary table
Grinding dimension   mm Max.Ø200 (φ 4 ″-φ 8 ″)
Diameter of grinding wheel   mm Φ200
Spindle Number of spindles - 2
Spindle power KW 4.2/5.5
Spindle speed rpm 1000-6000
Z-axis travel mm 120
Z-axis resolution Μm 0.1
Bearing table Loading method - vacuum adsorption
Bearing table type - Porous ceramic type (6/8 inch compatible)
Speed rpm 0-300
Number of sheet-bearing tables Sleeve 3
Thinning accuracy Intra-slice thickness deviation Μm ≤ 3
Thickness deviation between sheets Μm ≤ ± 3
Surface roughness Jin Μm ≤3(#30000 wheel,SiC)
Measuring instrument Measurement range Μm 0-1800 (optional)
Resolution Μm 0.1 (optional)
Repeat accuracy Μm ±0.5(Optional)
Equipment Overall dimension WxD × H mm 1200 × 1800 × 1950
Equipment weight kg Approximately 3300.

 

Key words:

WG-8500 automatic thinning machine

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