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WG-1271 ultra-precision thinning machine
Product Classification:
Details
Technical features:
● Back thinning to the integration of stress removal, shortens the working time outside the processing, and can stably implement the thinning processing and transmission of wafers with a thickness of less than 50 μm.
● Three-spindle four-station full-automatic thinning machine, with wafer rough grinding, fine grinding, polishing, transmission, cleaning, tearing film automatic precision thinning process capabilities. The third axis enables diverse applications of dry polishing/ultra-precision grinding (special options).
Performance indicators:
| WG-1240 automatic thinning machine | |||
| Grinding method (Z1,Z2) | Vertical plunge grinding by rotating the wafer | ||
| Grinding mode | Irregular longitudinal plunge grinding by wafer rotation | ||
| Structure mode | 3 spindles, 4 bearing tables and 1 rotary table | ||
| Grinding dimension | mm | Max.Ø300 (φ 8 ″-φ 12 ″) | |
| Grinding wheel diameter | - |
Φ300 mm Diamond wheel (Z1/z2-axis) Φ450 mm,Drv polishing pad (z3-axis) |
|
| grinding spindle | Type | - | High frequency motor built-in air spindle |
| Number of spindles | - | 3 | |
| Quota power | KW | 7.5 | |
| Spindle speed | rpm | 1000-4000 | |
| Bearing table | Loading method | - | vacuum adsorption type |
| Bearing table type | - | Porous ceramic type (8/12 inch compatible) | |
| Speed | rpm | 0-300 | |
| Number of sheet-bearing tables | Sleeve | 4 | |
| Measuring instrument | Measurement range | Μm | 0-1800 |
| Resolution | Μm | 0.1 | |
| Repeat accuracy | Μm | ±0.5 | |
| Material System | Number of wafer cassettes | Μm | 2 |
| Wafer Box Process Mode | Μm | Recycled water in the same box/different box | |
| Cleaning device | mm | Cleaning and drying | |
| Equipment | Overall dimension WxD × H | mm | 1905 × 3534 × 1874 |
| Equipment weight | kg | 6750 | |
Key words:
WG-1271 ultra-precision thinning machine
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