WG-1220 automatic thinning machine

WG-1220 automatic thinning machine

Widely applicable to materials other than silicon wafers, such as: grinding of hard and brittle materials and electronic component products (epoxy resin, lithium tantalate/lithium niobate, raw ceramics, sapphire);

Product Classification:

Automatic thinning machine

Semiconductor Equipment Division

Details

Technical features:

● Widely applicable to materials other than silicon wafers, such as: grinding of hard and brittle materials and electronic component products (epoxy resin, lithium tantalate/lithium niobate, raw ceramics, sapphire);
● Single-spindle single-station automatic thinning machine, covering an area of only 1.47 ㎡; Support axial feed (In-Feed) grinding principle and deep and slow feed (Creep-Feed) grinding principle (as a special option); Can correspond to various customization requirements.

 

Performance indicators:

WG-1220 automatic thinning machine
Grinding mode Vertical/horizontal plunge grinding by rotating the wafer
Structure mode 1 spindle, 2 sheet-bearing tables
Grinding dimension   mm Max.Ø300/Max.Ø200(ø4 ″-ø12 ″)
Spindle Number of spindles - 1
Spindle power KW 7.5/5.5
Spindle speed rpm 1000-4000/1000-6000
Z-axis travel mm 120
Z-axis resolution Μm 0.1
Bearing table Loading method - vacuum adsorption
Bearing table type - Porous ceramic table (size optional, customizable)
Speed rpm 0-300
Quantity Sleeve 1
Cleaning method of film bearing table - Manual cleaning of oilstone
Bearing table Y direction Y-direction machining stroke mm 400
Y-direction feed speed mm/s 0.01-50
Y axis fast displacement velocity mm/s 100
Y-axis minimum resolution mm 0.001
Equipment Overall dimension WxD × H mm 860 × 1847 × 1741
Equipment weight kg Approximately 1700.

 

Key words:

WG-1220 automatic thinning machine

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