WP-301D wafer double-sided grinding machine

WP-301D wafer double-sided grinding machine

6-inch wafer double-sided grinder for multiple material processing needs

Product Classification:

Automatic thinning machine

Semiconductor Equipment Division

Details

Technical features:

● It is mainly used for double-sided precision grinding process of cadmium zinc telluride, mercury cadmium telluride, gallium arsenide, indium phosphide, indium antimonide and other materials. The sun gear and ring gear can be linked or controlled independently;
● Equipped with independent and optimized high-precision embedded spindle system and pressure precision real-time control system; The upper plate adopts floating connection mode to ensure that it is parallel to the lower plate at any time during the grinding and polishing process. The grinding and polishing pressure can be monitored and corrected in closed loop according to the set process parameters.

 

Performance indicators:

WP-301D wafer double-sided grinding machine
Grinding method Double-sided grinding and polishing of the upper/lower surface of the wafer through the planetary gear rotation system
Structure mode 1 spindle, 2 grinding discs (or 2 polishing discs)
Grinding size   mm Max.Ø150(6 inches)
Spindle Number of spindles - 1
Lower disc speed rpm 0~30
Grinding disc Materials   Glass
Diameter mm Ø766
Quantity One 1 (upper plate), 1 (lower plate)
polishing disc Materials - Ceramics
Diameter mm Ø772
Quantity One 1 (upper plate), 1 (lower plate)
Cruise Pieces Quantity One 5
grinding and polishing pressure Pressure adjustment range kg 0.1~50
Equipment Overall dimension WxD × H mm 1572 × 1053 × 2533
Equipment weight kg Approximately 2300.

 

Key words:

WP-301D wafer double-sided grinding machine

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