HP-802 automatic dicing machine

HP-802 automatic dicing machine

Dual-axis automatic dicing machine for a variety of customized processing needs

Product Classification:

Automatic dicing machine

Semiconductor Equipment Division

Details

Technical features:

● Good at multi-piece cutting, can be customized worktable, the maximum workpiece size is 300 mmx300mm; Through the plural processing selection interface, it can realize the processing of multiple pieces of any number of pieces;
● Optional 2.4kW high-power spindle to meet the requirements of higher cutting quality; gantry structure, high rigidity, good stability; optional Sub-CT auxiliary sharpening function to ensure the maximum cutting quality.

 

Performance indicators:

Spindle Power KW 1.8 2.8
Scope rpm 6000-60000 3000-30000
X Axis Effective travel mm 300
Speed range mm/s 0.1-600
Resolution mm 0.001
Y axis Effective travel mm 300
Resolution mm 0.0001
Step accuracy mm 0.002/5
Total cumulative error mm 0.003/300
Z-axis Effective travel mm 22 (when using µ58 cutting blade)
Repeat accuracy mm 0.001
Support for maximum tool diameter mm 58 120
K Maximum turning angle deg 380°±5°
Repeat accuracy arc-sec 1 ″
Microscope Lens multiple - 15x (optional)
light source configuration - Ring light • straight light
Workpiece Circular workpiece size mm M300
Square workpiece size mm

300x300（无 Sub-CT)

285x285 ( Sub-CT)
Other Sub-CT auxiliary sharpening plate function - Optional
Overall dimension WxD × H mm 1085 × 1040 × 1805
Equipment weight kg 1200

 

Key words:

HP-802 automatic dicing machine

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