HP-1201 automatic dicing machine

HP-1201 automatic dicing machine

Dual-axis automatic dicing machine tailored for large-area packaging substrates

Product Classification:

Automatic dicing machine

Semiconductor Equipment Division

Details

Technical features:

● Good at multi-piece cutting, customizable worktable, supporting the maximum workpiece size of 400 mmx400mm; For 250mm x 70mm material strips, up to 5 strips can be pasted, with higher processing efficiency and can be specified for any workpiece processing;
● Equipped with dual-spindle, dual-axis spacing ≤ 22mm, higher production efficiency; gantry structure, high rigidity, good stability; optional Sub-CT auxiliary sharpening function, to ensure the maximum cutting quality.

 

Performance indicators:

Spindle Power KW 1.8
Scope rpm 6000-60000
X Axis Effective travel mm 420
Speed range mm/s 0.1-1000
Resolution mm 0.001
Y axis Effective travel mm 420
Resolution mm 0.0001
Step accuracy mm 0.002/5
Total cumulative error mm 0.003/400
Z-axis Effective travel mm 13 (when using µ58 cutting blade)
Repeat accuracy mm 0.001
K Maximum turning angle deg 380°±5°
Repeat accuracy arc-sec 1 ″
Microscope High power lens multiple - 15x (optional)
Low power lens multiple - 0.8x
light source configuration - Ring light • straight light
Workpiece Circular workpiece size mm M300
Square workpiece size mm

400x400（
Other Sub-CT auxiliary sharpening plate function - Optional
Overall dimension WxD × H mm 1450 × 1250 × 1850
Equipment weight kg 2000

 

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HP-1201 automatic dicing machine

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