HP-6103/6100 Automatic Dicing Machine

HP-6103/6100 Automatic Dicing Machine

Widely used in a variety of material cutting, cost-effective automatic dicing machine

Product Classification:

Automatic dicing machine

Semiconductor Equipment Division

Details

Technical features:

● Good at multi-piece cutting, can be customized worktable, the maximum workpiece size is 156 mmx156mm; Through the plural processing selection interface, it can realize the processing of multiple pieces of any number of pieces;
● Optional 2.4kW high-power spindle to meet the requirements of higher cutting quality; It is suitable for dicing process of ceramic substrate, glass, package, silicon wafer, discrete device, LED-PCB, resin package and optical communication device.

 

Performance indicators:

Spindle Power KW AC: 1.5/2.2; DC: 1.8/2.4
Scope rpm AC: 3000-40000; DC: 6000-60000
X Axis Speed mm 230
Dimensions mm/s 0.1-400
Cooling mode mm 0.001
Y axis Effective travel mm 160
Resolution mm 0.0005
Step accuracy mm 0.002/5
Total cumulative error mm 0.003/160
Z-axis Effective travel mm 22 (when using µ58 cutting blade)
Repeat accuracy mm 58
Support for maximum tool diameter mm 0.001
K Maximum turning angle deg 320°
Repeat accuracy arc-sec 15°
Microscope Lens multiple - 15x (optional)
light source configuration - Ring light • straight light
light source configuration - Ring light • straight light
Workpiece Circular workpiece size mm 6 inches
Square workpiece size mm 156 × 156
Other Overall dimension WxD × H mm 608 × 900 × 1650
Equipment weight kg 500

 

Key words:

HP-6103/6100 Automatic Dicing Machine

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