HP-802C automatic dicing machine

HP-802C automatic dicing machine

Wafer dicing machine for silicon carbide dicing

Product Classification:

Automatic dicing machine

Semiconductor Equipment Division

Details

Technical features:

● Can cut silicon carbide wafer, through parameter setting can realize multiple cutting, support the maximum workpiece size of 200 mmx200mm;
● With high-precision spindle to meet the requirements of higher cutting quality; gantry structure, high rigidity, good stability; standard Sub-CT-assisted sharpening function, can achieve automatic sharpening in the cutting process, to ensure the quality of cutting to the greatest extent.

 

Performance indicators:

Spindle Power KW 1.8
Speed range rpm 6000-60000
X Axis Effective travel mm 300
Speed range mm/s 0.1-600
Resolution mm 0.001
Y axis Effective travel mm 300
Resolution mm 0.0001
Step accuracy mm 0.002/5
Total cumulative error mm 0.003/300
Z-axis Effective travel mm 30 (when using µ58 cutting blade)
Repeat accuracy mm 0.001
Support for maximum tool diameter mm 58
K Maximum turning angle deg 380 ° ± 5 °
Repeat accuracy arc-sec 1 ″
Microscope Lens multiple - 15x (optional)
light source configuration - Ring light • straight light
light source configuration - Ring light • straight light
Workpiece Circular workpiece size mm µ8 and below
Square workpiece size mm

200mmx200（无Sub-CT)

200mmx200 ( Sub-CT)
Other Equipment outline mm 1085 × 1040 × 1805
Weight kg 1200

 

Key words:

HP-802C automatic dicing machine

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