Push-plate type glue discharging furnace

Push-plate type glue discharging furnace

It is suitable for high temperature sintering of nickel electrode chip ceramic capacitor chips in nitrogen (hydrogen) atmosphere, so that the chip medium becomes a dense ceramic, ensuring the stability of various parameters and performance of the product, and can be produced in large quantities continuously.

Product Classification:

Products

Industrial Kiln Division

Push plate type

Details

Technical parameters:

Furnace size (approx.)

15000 × 460 × 240 (l×w×h) mm

Furnace mouth size

460 × 240 (w×h) mm

Overall dimensions (approx.)

17400 × 2400 × 1750(L×W×H)mm (the above dimensions are the maximum values)

Working temperature

320 ℃

Temperature control accuracy

± 1 ℃ (subject to instrument display)

uniformity of furnace section

± 4 ℃ (to be determined)

furnace atmosphere

Air

surface temperature rise

≤ 20 ℃ (to be determined)

Maximum heating power

About150kW

Insulation power

About70kW

Power

380VAC 50Hz three-phase five-wire system

Heating mode

Using high temperature resistant heating wire, heating

 

Key words:

Push-plate type glue discharging furnace

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